Hack-saw frame designed to remove excesses from the interproximal area. Designed to removal excesses of composites, adhesives, cements and amalgams from the proximal area. Also indicated for Inlay and Onlay, laminated vaneers and stripping in orthodontic procedures. Features Device developed to adapt special components: Saw Blade: – remove surplus material without damage...
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Hack-saw frame designed to remove excesses from the interproximal area. Designed to removal excesses of composites, adhesives, cements and amalgams from the proximal area. Also indicated for Inlay and Onlay, laminated vaneers and stripping in orthodontic procedures.
Features
Packing
1 hack Saw frame +1saw +1 sanding blade.